Sel Chemical Co., Ltd

Products

	Intermediate for Copper Plating

For Copper plating:
DPS (N,N-dimethyl-dithiocarbamyl propyl sulfonic acid, sodium salt, CAS No:18880-36-9)
Q75 [N,N, N?,N?-Tetrakis(2-hydroxypropyl)ethylenediamine］
JPH (EXPO2887) (Aqueous of cross-linking polyamide)
H1(2-mercapto thiazoline, CAS No:96-53-7)
M(2-mercapto-benzimidazole, CAS No:583-39-1)
Water-soluble M [ 3-(benzimidazoyl-2-mercapto)-propylsulfonate]
MPS(3-mercapto-1-propane sulfonic acid, sodium salt, CAS No:17636-10-1) N(Ethenethiourea, CAS No:96-45-1)
SPS[ Bis-(sodium sulfopropyl)-disulfide, CAS No:27206-35-5]
UPS(3-S-isothiuronium propyl sulfonate, CAS No:21668-81-5)
ZPS[ 3-(benzothiazolyl-2-mercapto)-propyl-sulfonic acid, sodium salt, CAS No:49625-94-7];

Packing: 25kg / drum

For any question, please contact us freely.