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Intermediates for Nickel Plating |
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Chloral hydrate
ALS 25% &35% & 95%(Sodium allyl sulfonate,CAS No: 2495-39-8)
ATP ( Carboxyethylisothiuronium chloride, CAS No: 5425-78-5)
BBI [Bis (benzene sulphonyl)-imide, CAS No:2618-96-4]
BEO(Butynediol ethoxylate, CAS No; 1606-85-5)
BMP(Butynediol propoxylate, CAS No: 1606-79-7)
BOZ(2-butyne-1.4-diol, CAS No:110-65-6)
BCES ( Butynyl chlorohydrinether sulfonate, CAS No: 67874-62-8)
BEH (Reaction product of 2-butyne-1,4-diol with epichlorohydrin, CAS No: 68876-96-0)
DEP(1-Diethylamino-2-propyne, CAS No:4079-68-9)
HD-M (2.5-dimethyl-2.5-hexynediol, CAS No: 142-30-3)
POPDH(Propargyl-oxo-propane-2,3-dihydroxy, CAS No:13580-38-6)
PABS(Diethylaminopropyne formate, CAS No:125678-52-6)
PAP(Propargyl alcohol propoxylate, CAS No:3973-17-9)
PA (Propargyl alcohol)
PME(Propynol ethoxylate, CAS No:3973-18-0)
PS ( Propynesulfonic acid sodium salt, CAS No:55947-46-1)
PN (Hydroxymethanesulfonic acid, monosodium salt, CAS No:870-72-4) PPS-OH 40% &45% (Pyridinium hydroxyl propyl sulfonate, CAS No: 3918-73-8)
PPS ( Pyridinium propyl sulfobetaine, CAS No:15471-17-7)
Wetting agent for nickel plating
TC-EHS(2-Ethylhexylsulphate, sodium salt, CAS No:126-92-1)
DPX(low-foam wetting agent)
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